The 1st Asian Conference on Adhesion
- New Generation for Academic and Industry -

November 16-19, 2005

Ramada Plaza Jeju Hotel, Jeju, Korea

Organized by The Society of Adhesion & Interface, Korea
In cooperation with The Society of Adhesion of Japan and Beijing Adhesion Society

Organizer

Conference Chair: Prof. Won Ho Jo
(President of The Society of Adhesion and Interface, Korea)

Conference Vice-Chairs:
Prof. Hirokuni Ono(President of The Adhesion Society of Japan)
Mr. Zhai Haichao(President of Beijing Adhesion Society)

Conference Organizing Committee
Co-Chairs:
Kilwon Cho (Pohang University of Science and Technology, Korea)
Hyun-Joong Kim (Seoul National University, Korea)
Members:
Kil-Yeong Choi (Korea Research Institute of Chemical Technology, Korea)
Jae Heung Lee (Korea Research Institute of Chemical Technology, Korea)
Tae-Ho Yoon (Gwangju Institute of Science and Technology, Korea)
Donghwan Cho (Kumoh National Institute of Technology, Korea)
Myung-Cheon Lee (Dongguk University, Korea)
Chong-Sun Yoo (Korea Institute of Footwear & Leather Technology)
Kwang-Soo Kim (Dongsung NSC, Korea)
Goan-Hee Yoon (VIXXOL Corp., Korea)
International Advisory Committee:
Prof. T. Kasemura (Gifu University, Japan)
Dr. Miyagi Zenichi (Meiji University, Japan)
Prof. Yu Yunzhao (ICCAS, China)
Mr. Luo Daoyou (Beijing Chemical Industry Research Institute, China)
Dr. Yi Xiaosu (Beijing Institute of Aeronautical Materials, China)
Prof. Zhang Junying (Beijing University of Chemical Technology, China)
Dr. Jun Que (Sika Technology AG, Switzerland)
Program committee:
Chang-Sik Ha (Pusan National University, Korea)
Young-Chul Kim (Korea Research Institute of Chemical Technology)
Joung-Man Park (Gyeongsang National University, Korea)
Jin-Who Hong (Chosun University, Korea)
Hyung Jung Kim (Kongju National University, Korea)
Sang-Taek Oh (Korea Institute of Footwear & Leather Technology)
Sung-Ryong Kim (Chungju National University, Korea)

Invited and Oral Presentation

Prefabricated Bonding Solutions for Modern Electronic Device Production (Invited)
Marc Husemann (tesa Tape, Germany)

Polymer Surface Modification by Ion-Beam Treatment and Its Effect on the Adhesion
with a Metal
Yongsok Seo, Sehyun Kim (Seoul Natl Univ., LG Chem. Co. Ltd Korea)

Nonconventional Preparation of Wood Composite
M. Kajiyama, S. Abe, M. Kiyabu, K. Sugimoto and B. Tomita(Univ. of Tsukuba, Japan)

Grafting Modification of Vinyl Monomers onto PET Film using UVIrradiation for the
Improvement of Adhesion Force
Young-Wook Song, Hyun-Sung Do, Dong-Hyuk Lim, Hyun-Joong Kim (Seoul Natl Univ., Korea)

Synthesis and Adhesion Property of Novel Polyimides from Trifluoromethylphenyl
Substituted Pyromellitic Dianhydrides
Bum-Young Myung, C. J. Ahn, J. H. Kim, Tae-Ho Yoon(Gwangju Inst. of Sci. and Tech., Korea)

Molecular Structure of Gecko Foot-Hair: Atomistic Molecular Dynamics Simulation of -Keratin
Hyewon Kim, June Huh, Won Ho Jo (Seoul Natl Univ., Korea)

Migration of Rosin-based Tackifier in Acrylic Emulsion Type Pressure Sensitive
Adhesives (Invited)
Taninaka, D. Kiga, N. Hori, A. Takemura, H. Ono(Univ. of Tokyo, Japan)

Application of High-performing Adhesive Bonding in AutomotiveIndustry
Jun Qu (Sika Technology AG, Switzerland)

Improvement on the Interfacial Properties of Natural Fiber Henequen/UPE
Biocomposites by Various Fiber Surface Treatments
Donghwan Cho, Sung Bong Yoon, Seong Ok Han, Won Ho Park
(Kumoh Natl Inst. of Tech., Korea)

Adhesion Performances of Acrylic PSA Containing UV-crosslink-able Moieties
Hyun-Sung Do, Hyo-Sook Joo, Hyun-Joong Kim(Seoul Natl Univ., Korea)

Stable Superhydrophobic Organic-Inorganic Hybrid Films by Electrostatic Self-
Assembly
Joong-Tark Han, Yanli Zheng, Kilwon Cho(Pohang Univ. of Sci. and Tech., Korea)

Adhesion Performance of UV-crosslinked SBS-based PSA
Dong-Hyuk Lim1, Hyun-Joong Kim1, Goan-Hee Yoon2(1Seoul Natl. Univ., 2VIXXOL Corp., Korea)

Adhesives in Electronics Industry (Invited)
Haichao Zhai, (Beijing Linktite Adhesives & Sealants Co. Ltd, China)

Switchable Tack with Side-Chain Liquid Crystalline Polymers
Kilwon Cho, Jeong Ho Cho, Jong-Chan Lee, Se-Hui Han (Pohang Univ. of Sci. and Tech., Korea)

FEM Analysis of Expansion Behavior of Dismantlable Adhesive Consisting of Epoxy
Resin and Thermally Expansive Microcapsules
Chiaki Sato, Yuich Nishiyama (Tokyo Inst. of Tech., Japan)

Environmental Issues and Adhesive Development in Sports Shoes Industry (Invited)
Kwang-Soo Kim (Dongsung NSC, Korea)

Synthesis and Characterization of A New Epoxy Resin with Double Bond as Side
Group
Zhang Jun-Ying￡￢Zang Xiao-A, Cui Wei-Min (Beijing Univ. of Chem. Tech., China)

Development of Biodegradable Functional Polymeric Materials
T. Kasemura, S. Takahashi, N. Tamura, T. Koike, M. Saga (Gifu Univ., Japan)

Poster Presentation

List of Participants

Various Sides of A.C.A05